Surface Mount Assembly
Our surface mount production lines are capable of precision placement of BGA, fine pitch QFP’s etc. and chip size down to 0402. We also have a fine line surface mount prototype facility offering a fast turnaround service that does not require expensive solder screen stencils.
We have recently invested heavily in a new SMD line to compliment our existing lines. This now gives us the capacity to build medium to high volume as well as small / pre-production assemblies in parallel.
Our placement capacity is now averaging 50,000 placements per hour.